TY  - BOOK
AU  - Gilleo,Ken
TI  - MEMS/MOEMS packaging: concepts, designs, materials, and processes 
SN  - 0071455566
AV  - TK7870.15 .G55 2005
U1  - 621.381/046 22
PY  - 2005///
CY  - New York
PB  - McGraw-Hill
KW  - Microelectromechanical systems
KW  - Microelectronic packaging
KW  - Optoelectronic devices
KW  - Mechatronics Engineering Technology
KW  - Electronics
KW  - Thiết bị điện quang
KW  - Vi điện tử học
KW  - Điện tử học
N1  - Includes bibliographical references (p. 203-213) and index
UR  - http://www.loc.gov/catdir/enhancements/fy0634/2005049594-t.html
UR  - http://www.loc.gov/catdir/toc/fy0606/2005049594.html
UR  - http://www.loc.gov/catdir/enhancements/fy0634/2005049594-b.html
UR  - http://www.loc.gov/catdir/enhancements/fy0634/2005049594-d.html
ER  -