Electronic assembly fabrication :  chips, circuit boards, packages, and components / 
Charles A. Harper, editor-in-chief. 
 - 1st ed. 
 - New York :  McGraw-Hill,  c2002. 
 - xv, 672 p. :  ill. ;  24 cm. 
 - Electronic packaging and interconnection series McGraw-Hill professional engineering .
<br/><br/><label>ISBN: </label>0071378820 (alk. paper) 
<br/><br/><label>LCCN: </label>2002-022737 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic apparatus and appliances--Design and construction.<br/>Mechatronics Engineering Technology<br/>Electronics.<br/>Semiconductors <br/>Mạch điện<br/>Thiết bị điện<br/>Điện tử học
<br/><br/><label>LC Class. No.: </label>TK7870  / .E4424 2002 
<br/><br/><label>Dewey Class. No.: </label>621.381  / ELE 2002