Proceedings / 1998 International Conference on Multichip Modules and High Density Packaging, April 15-17, 1998, The Adam's Mark Hotel, Denver, Colorado ; sponsored by IMAPS ... [et al.].

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TextLanguage: English Publication details: [New York] : Institute of Electrical and Electronics Engineers, c1998.Description: xi, 547 p. : ill. ; 28 cmISBN:

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Holdings
Item type	Current library	Call number	Copy number	Status	Date due	Barcode
Sách, chuyên khảo, tuyển tập	Phòng DVTT Tổng hợp Kho tham khảo	621.381/046 PRO 1998 (Browse shelf(Opens below))	1	Available		A-D0/05551

"IEEE catalog number: 98EX154"--T.p. verso.

Includes bibliographical references and index.

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