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_a621.381 _bTWE 2000 _2 22 |
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_aIEEE/CPMT International Electronics Manufacturing Technology Symposium _n(26th : _d2000 : _cSanta Clara, Calif.) |
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| 245 | 1 | 0 |
_aTwenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium : _bproceedings : 2000 IEMT Symposium : October 2-3,2000, Santa Clara, CA, USA / _csponsored by SEMI, Semiconductor Equipment and Materials International [and] CPM, the Components, Packaging, & Manufacturing Technology Society of the IEEE. |
| 246 | 3 | 0 | _aInternational Electronics Manufacturing Technology Symposium |
| 260 |
_aNew Jersey : _bIEEE, _c2000 |
||
| 300 | _a388 p. | ||
| 650 | 0 | _aBall grid array technology | |
| 650 | 0 | _aElectronic industries | |
| 650 | 0 | _aSemiconductors | |
| 650 | 0 | _aMechatronics Engineering Technology | |
| 650 | 0 | _aCông nghiệp điện tử | |
| 650 | 0 | _aHội nghị khoa học | |
| 650 | 0 | _aThiết bị bán dẫn | |
| 710 | 2 | _aComponents, Packaging & Manufacturing Technology Society | |
| 710 | 2 | _aSemiconductor Equipment and Materials International | |
| 900 | _aTrue | ||
| 911 | _aHoàng Yến | ||
| 912 | _aHoàng Thị Hoà | ||
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